Cooler Master CryoNamics Thermal pad - 1 piece
- dimentions: 40 x 30 x 0,2 mm
- Use Temperature: -40 ~ 125°C
15.99
13.- excl. VAT
In stock, expected delivery: 4 - 5 working days
Cooler Master CryoNamics Thermal pad - 1 piece
15.99
13.- excl. VAT
In stock, expected delivery: 4 - 5 working days
- Wide range of IT related products
- Low prices
- Fast and reliable delivery
- Order now, expected delivery: 4 - 5 working days
The Cooler Master CryoNamics Thermal Pad is a high-quality thermal interface solution designed to optimize heat transfer between components, making it an essential accessory for anyone looking to improve their system's thermal management. Whether used between a heatsink and a processor or across other heat-generating components, this thermal pad offers a reliable and mess-free alternative to traditional thermal pastes. Its compact and easy-to-apply design makes it suitable for both beginners and experienced builders alike.
Efficient Heat Dissipation
The CryoNamics Thermal Pad is engineered to minimize thermal resistance between surfaces, allowing heat to transfer more effectively away from critical components. By filling microscopic air gaps and surface irregularities, it helps maintain lower operating temperatures, which can contribute to more stable and consistent system performance over time.
Easy Application and Versatility
One of the key advantages of this thermal pad is its straightforward application process. Unlike liquid thermal compounds, the pad does not require spreading or curing time, reducing the risk of uneven coverage or accidental spills. It can be cleanly cut to size if needed, making it a versatile solution for a wide range of components and devices. Weighing just 2 grams, it is a lightweight yet effective addition to any cooling setup, fitting neatly into the Cooler Master accessory lineup for those seeking dependable thermal management solutions.
Efficient Heat Dissipation
The CryoNamics Thermal Pad is engineered to minimize thermal resistance between surfaces, allowing heat to transfer more effectively away from critical components. By filling microscopic air gaps and surface irregularities, it helps maintain lower operating temperatures, which can contribute to more stable and consistent system performance over time.
Easy Application and Versatility
One of the key advantages of this thermal pad is its straightforward application process. Unlike liquid thermal compounds, the pad does not require spreading or curing time, reducing the risk of uneven coverage or accidental spills. It can be cleanly cut to size if needed, making it a versatile solution for a wide range of components and devices. Weighing just 2 grams, it is a lightweight yet effective addition to any cooling setup, fitting neatly into the Cooler Master accessory lineup for those seeking dependable thermal management solutions.
Brand:
Cooler Master
Product number:
21815513
Product number manufacturer:
TPY-ADPG-3040-R1
Physical characteristics
Weight:
2 g
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