Fuma 3
The Fuma 3 CPU Cooler features a powerful twin-tower heat sink with an asymmetrical structure. Build on the basis of the legendary Fuma 2, the heat sink design was optimized with a higher fin density for improved cooling performance. Thanks to the improved layout the Fuma 3 offers full RAM compantiblity and can even be installed on small form factor Mini-ITX motherboards. Six high-quality 6mm heatpipes connect the separate heatsinks to the massive copper base plate. All copper parts have been elaborately nickel-plated. The Fuma 3 ships with two Kaze Flex II 120 PWM fans. In addition to the regular model, a slim version with a frame width of only 16 mm is used to keep the dimensions low. The Fuma 3 takes advantage of the principle of a “Reverse Airflow” design, in which the fans rotate in opposite directions. This creates higher static pressure as well as an increased and consistent airflow. The easy-to-use H.P.M.S. V mounting system supports all current CPU-Sockets including Intels LGA1700 and AMDs AM5.
New Asymmetrical Design
The Fuma 3 CPU-Cooler offers an improved asymmetrical heat sink layout which is optimized for excellent space management even for the most demanding Mini-ITX motherboards such as the Z690I series. The design features full access to the front RAM slots while also shifting the cooler slightly away from the GPU.
Stunning Performance
The state-of-the-art, robust radiator structure conforms to Scythe’s aerodynamic concept with a higher fin density, which increases the surface area for improved heat dissipation and cooling efficiency during operation.
Reverse Jet Flow
The Fuma 3 CPU-Cooler features two Kaze Flex II 120 fans, each working in a PWM range of up to 1,500 rpm. In addition, the fans rotate in opposite directions. This creates a higher static pressure as well as an increased and consistent airflow.
Kaze Flex II PWM Fans
Both Kaze Flex 120 II fans use a sealed fluid dynamic bearing (Sealed Precision FDB) that reduces friction and wear to a minimum thanks to a special oil film. Rubberized pads coveringe the frame have a decoupling effect and prevent the transmission of noise and vibrations to the case.
Hyper Precision Mounting System V (H.P.M.S. V)
The easy-to-install H.P.M.S. V mounting system offers optimal contact pressure and compatiblity to the latest CPU Sockets on the market including Intels LGA 1700 and AMDs AM5. A pre-assembled mounting bar with spring-loaded screws ensures balanced pressure distribution. During the installation process, the universal backplate is securely fixed to the mainboard by rubberized spacers, making the process considerably easier
Product number manufacturer:
SCFM-3000
Connectivity
Energy management
Physical characteristics
Sockets
LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, LGA 2011 (Socket R), LGA 2011-v3 (Socket R), LGA 2066, Socket AM4, Socket AM5
Technical details
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